Complex multilayer production process consisting of electronical and insulation conduction layers, anode/cathode layers, sealings and electrolyte paste based layers, either solvent or water-based, with wet coating thicknesses between a few microns (≤ 15 µm) up to several hundred (even ≥ 500 µm) are dried and sintered with coatings/layers adapted aLITE® process steps, all within one-digit seconds (even partially ≤ 1 s).

New multi-material, multi-process additive manufacturing platform solves issues of performance and cost, using 50% fewer materials to deliver up to twice the energy capacity in the same space or the same energy in half the space

New multi-layer PCB boosts electronics rapid prototyping

Sensor solutions provider HENSOLDT together with the leading Additively Manufactured Electronics (AME)/Printed Electronics (PE) provider, Nano Dimension, has achieved a major breakthrough on its way to utilizing 3D printing in the development process of high-performance electronics components. Utilizing a newly developed dielectric polymer ink and conductive ink from Nano Dimension, HENSOLDT succeeded in assembling the world-wide first 10-layer printed circuit board (PCB) which carries high-performance electronic structures soldered to both outer sides. Until now, 3D printed boards could not bear the soldering process necessary for two sided population of components.

3D printing is nothing new in itself. REHAU has been dealing with the possibilities associated with it for quite some time. This process offers great potential, especially for products manufactured in small batches. Now, thanks to a special printer from Israel, the company is going one step further and enabling 3D printing of electrical components.

Relying on 3D printing to fabricate their installation for the Cisco Live 2020 event yielded remarkable cost savings for Domestic Data Streamers while enabling this creative studio to design, produce and set up fully their unique Recommendation Wall in the astonishing period of only 4 weeks.

3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the photovoltaic, medical device and electronics markets, presents its microSHAPE laser systems for processing large and flat substrates at Laser World of Photonics 2019, taking place from June 24 to 27 in Munich, Germany.

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