New multi-layer PCB boosts electronics rapid prototyping

Sensor solutions provider HENSOLDT together with the leading Additively Manufactured Electronics (AME)/Printed Electronics (PE) provider, Nano Dimension, has achieved a major breakthrough on its way to utilizing 3D printing in the development process of high-performance electronics components. Utilizing a newly developed dielectric polymer ink and conductive ink from Nano Dimension, HENSOLDT succeeded in assembling the world-wide first 10-layer printed circuit board (PCB) which carries high-performance electronic structures soldered to both outer sides. Until now, 3D printed boards could not bear the soldering process necessary for two sided population of components.

3D printing is nothing new in itself. REHAU has been dealing with the possibilities associated with it for quite some time. This process offers great potential, especially for products manufactured in small batches. Now, thanks to a special printer from Israel, the company is going one step further and enabling 3D printing of electrical components.

Relying on 3D printing to fabricate their installation for the Cisco Live 2020 event yielded remarkable cost savings for Domestic Data Streamers while enabling this creative studio to design, produce and set up fully their unique Recommendation Wall in the astonishing period of only 4 weeks.

3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the photovoltaic, medical device and electronics markets, presents its microSHAPE laser systems for processing large and flat substrates at Laser World of Photonics 2019, taking place from June 24 to 27 in Munich, Germany.

New machine solutions for high-efficient laser processing

3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the photovoltaic, medical device and electronics markets, presents new machine solutions for laser micromachining at Laser World of Photonics – the world’s leading trade show for the laser and photonics industry – in hall A2 at booth 129 on the New Fair Munich exhibition grounds from June 24 to 27, 2019.

StoreDot and Nissan Chemical Partner to Advance Superior Colour, Environmentally-Friendly, Heavy-Metal Free Solution for TV Displays

Nissan Chemical to expedite the development and production of high performance in-pixel wavelength conversion coating materials
StoreDot’s MolecuLED™ optimized for printing and photolithography for wide-colour gamut displays delivering superior colour experience and reduced costs

At TCT Asia from 21 to 23 February 2019, ARBURG will be at stand D60 in hall W5 showcasing the additive manufacturing of functional plastic parts made from qualified original materials. Two freeformers will process TPE-S and PC for applications in medical technology and electronics.

Research led by the University of Leicester, working with the University of Cambridge, Loughborough University and University Hospitals of Leicester, has finally uncovered the truth about Richard III's spinal condition.

Historical and literary references to the physical deformities of Richard III, who ruled England from 1483-1485, are well-known, but debate has raged for centuries over the extent to which these descriptions are true. Various historical and literary references refer to Richard III as "crook-backed" or "hunch-back'd" , but until now, it was unknown whether these descriptions were based on Richard's actual appearance, or were an invention of later writers to damage his reputation.

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