New multi-layer PCB boosts electronics rapid prototyping

Sensor solutions provider HENSOLDT together with the leading Additively Manufactured Electronics (AME)/Printed Electronics (PE) provider, Nano Dimension, has achieved a major breakthrough on its way to utilizing 3D printing in the development process of high-performance electronics components. Utilizing a newly developed dielectric polymer ink and conductive ink from Nano Dimension, HENSOLDT succeeded in assembling the world-wide first 10-layer printed circuit board (PCB) which carries high-performance electronic structures soldered to both outer sides. Until now, 3D printed boards could not bear the soldering process necessary for two sided population of components.