3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the photovoltaic, medical device and electronics markets, presents its microSHAPE laser systems for processing large and flat substrates at Laser World of Photonics 2019, taking place from June 24 to 27 in Munich, Germany.

The modular microSHAPE platform is used in all applications where highly dynamic laser processing with precision requirements in the micrometer range on substrates up to 2,000 × 6,000 mm in size are to be realized. Applications include structuring and cutting of glass, surface modifications or structuring of metal substrates as well as the production of printing plates and embossing tools.

The microSHAPE axis system can be flexibly adapted to the application and can be configured to match the process in terms of performance or dynamics. Depending on the configuration level, axis speed of up to 1.5 m/sec., acceleration of 1.5 g and a repeating accuracy of ±1 μm can be achieved. Depending on the application, different beam deflection systems and laser sources can be integrated. For high-efficient processing, high power nanosecond or picosecond lasers are used in combination with highly dynamic 2D / 3D galvanometer scanners or with polygon scanners.

he substrates are inserted and removed in a specially developed handling system, which supplies the substrates semi-automatically or fully automatically to the laser unit. If required this can also be done largely without surface contact. The high-precision alignment of the substrates as a standard is realized automatically. Height variations of the substrates can be easily compensated either by adapted beam shaping or by tracking of the laser focus. 3D-Micromac’s user-friendly machine software processes customer layouts quickly and controls the complete machining process.
www.3d-micromac.com

 

Meet Our Sponsors

Latest HP News

Articles Most Read

Latest News

Statistics

Articles View Hits
247864

Who's Online

We have 13 guests and no members online